NEW GRYPPER/G80 Socket for TELEDYNE’s Radiation Tolerant DDR4 Memory Multi-Chip Package

Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use of semiconductor devices. IC packages covered include; QFN, BGA, SOIC, QFP, LGA, WLCSP and other SMT packages. Our GHz line of sockets with 6 different contact technologies supports up to 110 GHz bandwidth, ≥0.2mm pitch, ≤10000 pins,  500K insertions and the smallest footprint in the industry.

 GRYPPER/G80 SOCKETS

• Package-size PCB footprint: Since the PCB footprint of GRYPPER/G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test
• Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket
• No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device
• Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection

The GRYPPER/G80 Socket shown is for DDR4T04G72AZ TELEDYNE’s - 4GB / 8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) Device.