An ideal guide for developers of high resolution or high speed cameras used in machine vision, medical, scientific, and military/aerospace applications.
榮夏科技為Andon Electronics 代理商
High resolution, high speed, and 3D imaging are features that increase the value — and the cost — of related image sensors.
Not surprisingly, protecting these valuable image sensors against damage during the production of the electronics within the camera is of increasing concern in camera hardware design, especially for the more sophisticated cameras used in industrial (e.g., machine vision), aerospace, defense and homeland security, scientific, and medical/life science applications.
Solution: image sensor sockets
Depending on the cost of the socket compared to the cost of the device, socketing has been widely regarded as a cost-effective way to circumvent the device damage and solder joint cracking associated with soldering the device directly to the PCB. Instead, the socket — not the device — is soldered directly to the PCB. Then the device is inserted into the socket.
Sockets have, in some applications, had the additional advantage of facilitating field replacement of the device.
They enable the user to simply remove the device from the socket and plug in a new one — without having to remove the entire PCB, desolder the device (and risk damaging the device in the process), and then solder a new device to the PCB.
Foremost among them has been a growing understanding of the connection between RoHS-influenced solder temperature elevation and the associated device damage and solder joint cracking.
To some degree, this growing understanding was inevitable as more time passed since the implementation of the RoHS Directive.
Check out this published Vision Spectra Magazine feature article, Image Sensor Sockets: A Key Factor in Camera Design authorized by Andon Electronics Vice President Scott Tate.