榮夏科技為Ironwood Electronics 在TAIWAN台灣地區代理商

Connectors using elastomer, spring pin, and pin/socket interconnect technologies provide up to 94 GHz of bandwidth in the smallest possible footprint, for both prototype and production applications.

These rugged interconnects utilize our laser-and-laminate processes for rapid development and short lead-times, without expensive hard tooling.

They support pitches from 0.3mm to 2.54mm and heights from 0.25mm to 5mm.

FEATURES

• Shortest Contact: Highest bandwidth applications - 50GHz
• Dual Spring Contact: Low contact resistance - 20mOhms
• Laminated Substrate: No internal hardware - small footprint allows to be placed in location where conventional molded connectors obstruct
• Laser Cut Substrate: Precise contact location - 25 micron positional tolerance
• Soft Tool: Configurable stack height and location

本文章引用自Ironwood Electronics的網頁資訊

https://www.ironwoodelectronics.com/products/board-to-board-connectors-for-high-speed-applications/