Prototyping Adapters

 

Ironwood Electronics has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFN, QFP, SOIC, PGA, PLCC, QIP, and DIP packages. We use high quality production and test burn-in sockets for reliable connections. Most popular development panels are supported.

Standard Parts

 

Proto Adapters - Simplifies system development

The purpose of an Ironwood Prototyping Adaptor is to convert one of the many varieties of IC packages to male pins matching the pattern of customer's prototyping panel. There are many different prototyping systems on the market but most of them rely on wire wrap technology. A wire wrap system allows the placement of IC's on one side of a panel with long square pins extending from the other side of the panel. A very fine gauge wire is stripped and wrapped around these pins to perform the interconnection required for the circuit. All wire wrap systems are based on a 0.1" grid, but not all points of the grid may be available for use. Some have a fixed array of pins installed in the panel, and some are blank boards where the user places pins wherever they need them. Of the fixed array type, many different patterns are available. Ironwood's prototyping adapters support eight types of 0.1" panels (see prototyping panel type descriptions). For panels requiring wire wrap pins, all of Ironwood's prototyping adapters are available in wire-wrap pin versions (see prototyping adapter pin descriptions). Part numbers ending in "W" indicate that the part incorporates wire wrap pins(for example, "PA-BGA72A-C-S-01W"). All of Ironwood's pins are gold plated for maximum reliability.

We offer prototyping adapters for each of the following package types and socket options. Follow the links to the appropriate catalog section and list of standard parts.

QFN Prototyping Adapters

We offer prototyping adapters for QFN from 8 to 100 pins and body sizes from 2X3mm to 12X12mm. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated pins and short traces insure integrity in mechanical and electrical connections.

 

QFN with ZIF Sockets

These adapters provide ZIF sockets for the QFN device. ZIF sockets incorporated in these adapters are our own high performance GHz BGA sockets . All of the ZIF sockets employ elastomer contacts and can be replaced with spring pins or other contact types.

 

DUT (Device Under Test) PGA

These adapters connect various IC packages to functional and parameter verification testers with PGA DUT interfaces. Most of our DUT adapters have ZIF sockets (-Z) but some have SMT lands for the highest possible electrical integrity.

 

BGA with Surface Mount Lands

These adapters provide surface mount lands for attaching the BGA device. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated press fit pins and short trace lengths insure high integrity in mechanical and electrical connections. Email Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 for more information.

 

BGA with ZIF Sockets

These adapters provide ZIF sockets for the BGA device. Several styles of ZIF sockets are employed, including "Clam Shell", "Open Top", and "Open Top with Lever". All of the ZIF sockets employ gold contacts and are capable of 10,000 insertion cycles. Email Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 for more information.

 

DIP

These prototyping adapters for DIP devices are vertically oriented, saving panel space. These adapters can also be combined with our DIP to DIP package converters.

 

PGA

We offer well over 200 PGA prototyping adapters. Like all of Ironwood's prototyping adapters, all male and female contacts are gold plated. Be sure to refer the individual drawing to help you select the adapter that has the appropriate PGA pattern for your part.

 

PLCC with Sockets

Most of our PLCC prototyping adapters utilize production sockets, however, parts numbers that include a "Z" indicate that the adapter has a ZIF socket.

 

QIP

We offer prototyping adapters for QIP packages in a variety of sizes ranging from 34 to 90 pins. Like all of Ironwood's prototyping adapters, all male and female contacts are gold plated. Be sure to check the package dimensions and prototyping panel information to assure compatibility with your part.

 

QFP with Surface Mount Lands

These adapters provide surface mount lands for attaching the QFP device. They employ high temperature FR4/G10 substrate which allows package soldering and rework without damage. Gold plated press fit pins and short trace lengths insure high integrity in mechanical and electrical connections.

 

QFP with Production Sockets

These adapters incorporate a QFP production socket from 3M Textool or AMP. They support lead pitch of 0.025" in several sizes. Adapters with Textool sockets require a latching aid tool for easy IC insertion.

 

QFP with ZIF Sockets

We offer over 300 prototyping adapters for QFP devices that incorporate ZIF sockets. Many prototyping panel and QFP package combinations are available, so be sure to check the panel and package information.

 

SDIP (Shrink DIP)

These prototyping adapters for SDIP devices with 0.070" pitch provide a connection to typical 0.10" pitch prototyping panels. Be sure to check the adapter's package dimensions for compatibility with your part.

 

SOIC

Ironwood's SOIC prototyping adapters may be used with almost all of our supported panel types. Our PA-SOxx-S-V-nn series (shown in adjacent picture) of prototyping adapters allow the SOIC package to be mounted vertically, saving space on your prototyping panel. These adapters are also power and ground pin configurable with decoupling lands.

 

SOT

We offer prototyping adapters for SOT packages ranging from 5 to 8 pins. Like all of Ironwood's prototyping adapters, all contacts are gold plated. Be sure to check the package dimensions and prototyping panel information to assure compatibility with your part.

 

ZIP

We offer prototyping adapters for ZIP devices with 16 to 36 pins. Our 32 and 36 pin ZIP adapters are gang-able to accommodate larger pin counts.




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