榮夏科技為Ironwood Electronics 在TAIWAN台灣地區代理商

The Spring Pin Socket line allows very high endurance and wide temperature range testing of 0.3mm to 1.27mm pitch BGA, LGA , QFN, QFP and SOIC devices on the same footprint as other Ironwood socket technologies.

The unique offset external spring enables signal pass through from plunger to PCB directly without looping through inductive spring coils. These spring probes can be customized very easily for specific test height, force, plating finish, materials, etc.

This allows different PCB’s with same footprint to accomplish many different test applications.

FEATURES AND BENEFITS

• Long Contact Travel:  Compliancy for package non-coplanarity
• Gold Plated BeCu Material: High temperature applications
• Small Socket Footprint: Easy to place components very near the device, i.e. tuning inductors, by pass capacitors, resistors, etc. - ideal for IC prototype and system testing and field upgradeable system designs
• High Resilient Spring: Compression cycles in hundreds of thousands
• Optimized Pin Diameter to Length Ratio: Impedance matched high speed applications
• Solid Machined Contact: High current applications

本文章引用自Ironwood Electronics的網頁資訊

https://www.ironwoodelectronics.com/products/spring-pin-sockets/