榮夏科技為Ironwood Electronics 在TAIWAN台灣地區代理商

19x19mm body, 22X22 array 484 ball BGA package to be SMT attached to top adapter or placed inside compression mount socket mounted to top adapter.

Bottom adapter attached to target PCB using reflow.

Top and bottom adapters can be plugged/un-plugged multiple times and operated without compromising performance in rugged automotive applications.

本文章引用自Ironwood Electronics的網頁資訊

https://www.ironwoodelectronics.com/press/chip-size-0-8mm-pitch-bga-socket-adapter/