Model SE101 piezoresistive sensor die is specially designed for high-volume applications, e.g., medical devices, automotive industry, and consumer electronics.

Model SE101 piezoresistive sensor die is specially designed for high-volume applications, e.g., medical devices, automotive industry, and consumer electronics. This sensor die is manufactured through 6″ wafer silicon-on-silicon process by MEMS technology. It features a miniature dimensions of 0.9mm x 0.9mm x 0.5mm. Thanks to its unique design of the pressure diaphragm, the SE101 possesses not only high sensitivity but also extraordinary overload pressure (proof pressure and burst pressure).

As a non-signal-conditioning sensor die, the SE101 is available in a closed-bridge circuit with 4 solder pads.

Before packing, each SE101 sensor die is individually tested and qualified to its specifications.